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2023
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Thermal Sink Applications of Diamond Films
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Diamond boasts an exceptionally wide bandgap, a high breakdown electric field, high carrier mobility, and excellent radiation resistance. Consequently, owing to these outstanding properties, it plays a crucial role in high-power, high-frequency, and high-temperature applications. It can be said that diamond thin-film thermal‑dissipation materials hold vast application prospects and a promising development trajectory.
Thermal Sink Applications of Diamond Films
Diamond boasts an ultra-wide bandgap, a high breakdown electric field, high carrier mobility, exceptional thermal conductivity, and excellent radiation resistance. Consequently, leveraging these outstanding properties, it plays a crucial role in high‑power, high‑frequency, and high‑temperature applications. It can be said that diamond thin‑film heat‑sink materials hold vast application potential and are poised for significant development.
The following are some common application areas for diamond‑film heat sinks:
1. In the field of optical communications, large-area CVD diamond films, owing to their high thermal conductivity, hold promise for thermal management in high-power laser diode arrays and other microelectronic and optoelectronic devices; the thermal conductivity of diamond films can reach 2200 W/m·K.
2. Diamond thin-film heat sinks hold great potential for chip thermal management, particularly in the development of multi-chip assembly technologies. These technologies aim to densely arrange and integrate multiple VLSI chips in a three-dimensional configuration, thereby creating ultra‑compact, high‑performance devices. Diamond films are an ideal material for addressing the thermal challenges associated with such advanced packaging approaches.
3. In the field of new-energy vehicles, diamond is a direct competitor to silicon carbide. Unlike silicon carbide, which has a maximum operating temperature of 200°C, diamond can function reliably at temperatures exceeding 500°C. Similar to many challenges faced in military and aerospace applications—such as high-temperature environments—the automotive industry also needs to address the issue of overall thermal losses in engines.
4. In the 5G base station sector, the average power consumption per tenant is approximately 3.8 kW—more than three times that of a 4G base station. Electricity costs could erode operators’ entire profit margins. By employing diamond films as thermal management materials in 5G base stations, their exceptional heat‑dissipation performance can be fully leveraged, reducing energy consumption and truly achieving green, environmentally friendly, low‑carbon operations.
5. In the military aerospace sector, gallium nitride (GaN) is seeing accelerated exploration of its applications. Combining gallium nitride with diamond can enable a quantum leap in performance.
6. In the field of high-power electronic devices, diamond‑film heat sinks can effectively address thermal management challenges, enhancing device performance at the same footprint. The dimensions of diamond‑film copper heat sinks are no longer limited to single units or small arrays; array sizes can be scaled up to several centimeters and are widely adopted across a range of applications. When applied in phased‑array chips, they can substantially improve system reliability while reducing both size and cost. In solid‑state power amplifiers, such solutions can significantly lower device size, cost, and weight, while simultaneously boosting efficiency.
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