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“Core” Future, “Core” Solutions | Uniplasma showcases at the 27th China Hi-Tech Fair and the Asia Semiconductor and Integrated Circuit Industry Exhibition
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On November 16, the 27th China Hi-Tech Fair and the Asia Semiconductor and Integrated Circuit Industry Exhibition concluded successfully at the Shenzhen (Bao’an) International Convention and Exhibition Center. At the event, Uniplasma showcased its MPCVD equipment and diamond material products, offering a “core” solution to address the semiconductor industry’s “thermal management crisis” and injecting “core” momentum.
On November 16, the 27th China Hi-Tech Fair and the Asia Semiconductor and Integrated Circuit Industry Exhibition concluded successfully at the Shenzhen (Bao’an) International Convention and Exhibition Center. At the event, Uniplasma showcased its MPCVD equipment and diamond material products, offering a “core” solution to the semiconductor industry’s “thermal management crisis” and injecting “core” momentum.
As 6G communications, artificial intelligence, and high‑performance CPU/GPU workloads continue to surge, conventional copper‑based heat dissipation, heat pipes, and air‑cooling systems are increasingly approaching their limits when confronted with hotspots exceeding hundreds or even thousands of watts per square centimeter, making it difficult to meet the thermal management requirements of high‑power chips.
Among numerous thermal‑sink materials, diamond boasts an intrinsic thermal conductivity as high as 2000 W/(m·K), which is four times that of copper and more than eight times that of aluminum. Meanwhile, its coefficient of thermal expansion is only 1.0–1.5 × 10⁻⁶/K, closely matching that of silicon and silicon carbide—key materials in semiconductor chips (2.7 × 10⁻⁶/K). This remarkable thermal‑property similarity ensures that diamond‑based thermal sinks maintain interfacial stability even after tens of thousands of thermal cycles, effectively preventing interface delamination caused by thermal‑expansion mismatch.
These outstanding physical and chemical properties enable diamond not only to dissipate heat but also to deliver unique value in applications such as laser devices, optical windows, and specialized sensors, thereby offering the semiconductor industry a more diversified array of material options.
Therefore, Uniplasma’s diamond material products immediately became the center of attention at the exhibition. Attendees engaged in extensive discussions on the thermal management performance of diamond, innovative achievements, case studies, market conditions, and other diverse application scenarios, jointly exploring how diamond materials can inject new momentum into the development of the semiconductor industry.
This appearance not only marks an important opportunity for Uniplasma to showcase its technological prowess and innovative achievements to the industry, but also aims to collaborate with partners across the entire value chain to advance the innovative applications of diamond materials in an expanding range of semiconductor scenarios, enabling this material—boasting the highest thermal conductivity in nature along with exceptional hardness and optical properties—to be swiftly transformed into an advanced material solution suitable for large-scale deployment in the semiconductor industry.
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On September 17, Uniplasma and Huanghe Xuanfeng jointly established a joint venture—Henan Fengyouchuang Materials Technology Co., Ltd. (hereinafter referred to as Henan Fengyouchuang). This collaboration not only represents an efficient synergy between “cutting-edge technology” and an “industrial flagship,” but will also seamlessly close the entire industrial chain—from “equipment R&D” and “material growth” to “large-scale application”—marking a major leap from technological leadership to market leadership. Uniplasma Chairman Quan Feng, Huanghe Xuanfeng Chairman Li Ge, Vice Chairman and General Manager Pang Wenlong, and others attended the signing ceremony.
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