14

2026

-

09

Empowering Sensing, Advancing Optics | Uniplasma Shines at the 27th China International Optoelectronic Exposition

Author:


From September 9 to 11, the 27th China International Optoelectronic Exposition (CIOE 2026) was grandly held.

From September 9 to 11, the 27th China International Optoelectronic Exposition (CIOE 2026) was grandly held. To showcase the company's deep expertise in MPCVD equipment and diamond material preparation and applications, Uniplasma made a high-profile appearance with its core technologies and products spanning the entire industry chain, becoming one of the most closely watched benchmark exhibitors at the venue.

As a leading enterprise in the domestic MPCVD equipment and diamond materials sector, Uniplasma's exhibited products precisely address the growing demand for next-generation material upgrades in the optoelectronic and semiconductor industries.

In the field of optical applications, the company's optical-grade diamond features ultra-broad spectral transmittance from ultraviolet to far-infrared, exceptional hardness, and outstanding thermal stability, making it widely applicable to high-power laser windows, infrared optical windows, and precision optical components.

Leveraging its independently designed MPCVD equipment, Uniplasma has achieved stable, batch-scale growth of large-size, high-quality optical-grade diamond, providing reliable solutions for optical systems operating in extreme environments.

In the semiconductor heat sink sector, the company highlighted its 4- to 8-inch flexible polycrystalline diamond films and heat sink discs with thicknesses ranging from 0.1 to 1 mm. These products feature controllable thermal conductivity and excellent uniformity, making them another standout attraction at the booth.

Throughout the exhibition, Uniplasma's booth was consistently bustling with activity and vibrant exchanges. Professional visitors from fields including optical communications, semiconductors, lasers, and consumer electronics stopped by to engage in in-depth discussions with the technical team on topics such as MPCVD equipment processes, customized heat sink parameters, and coating compatibility for optical windows.

Many attendees remarked that with the explosive growth of AI computing infrastructure, 5G communications, and new energy vehicles, the thermal management challenge of high-power chips has become a global bottleneck constraining industry progress — and the practical advancement of diamond materials has offered a glimpse of hope for breaking through.

Looking ahead, the company will continue to deepen its expertise in microwave plasma application technology, accelerate the industrialization of diamond in frontier fields such as optical windows and high-power chip thermal management, and continuously inject "Uniplasma momentum" into the innovative development of the optoelectronic and semiconductor industries.

Related News

Empowering Sensing, Advancing Optics | Uniplasma Shines at the 27th China International Optoelectronic Exposition

From September 9 to 11, the 27th China International Optoelectronic Exposition (CIOE 2026) was grandly held.

Collaborative Innovation, Converging the Core | UPL Shines at the 14th Western Global Semiconductor Expo

From July 15 to 17, the 14th Western Global Semiconductor Expo (CWICE 2026) was held at the Chengdu Century City New International Convention and Exhibition Center. As a leading domestic player in MPCVD (Microwave Plasma Chemical Vapor Deposition) equipment and high-quality diamond materials, UPL (Youpulai) showcased its proprietary MPCVD systems and premium diamond substrates at the event.

Innovation-Driven, Future-Focused: UPL showcased at FINE 2026 – The Future Industry New Materials Expo

From June 10 to 12, the 2026 Future Industry New Materials Expo (FINE 2026) was held at the Shanghai New International Expo Centre. At the event, UPL made a prominent appearance, presenting its MPCVD (Microwave Plasma Chemical Vapor Deposition) systems alongside comprehensive diamond material solutions for diverse application scenarios. The company engaged with industry peers and downstream customers to explore the innovative uses and future trajectory of diamond in the semiconductor sector.

Jointly Exploring New Frontiers, Jointly Creating a New Future | Uniplasma Makes Its Debut at the 2026 (Second) Future Semiconductor Industry Innovation Conference

On April 16–17, the 2026 (Second) Future Semiconductor Industry Innovation Conference was grandly held at Yinsan Lake in Suzhou.

Connecting through chips, shaping the future together | Uniplasma showcases at the 2nd Fourth-Generation Semiconductor Technology Symposium

On March 18–19, the 2026 Second Symposium on Fourth-Generation Semiconductor Technology was grandly held in Hangzhou. As a leading enterprise in China’s MPCVD equipment and diamond materials sectors, Uniplasma showcased its core products and technical solutions at the conference, engaging in in-depth exchanges with industry peers and jointly discussing the future of the sector.

Strong Partnership | Uniplasma joins hands with Huanghe Xuanfeng, and China’s first 8-inch diamond heat sink production line has been officially completed.

On February 28, the unveiling ceremony of Henan Fengyouchuang Materials Technology Co., Ltd. (hereinafter referred to as Henan Fengyouchuang), a joint venture established by Shenzhen Uniplasma and Huanghe Xuanfeng, was solemnly held in Xuchang. Attending the ceremony were Yang Zengjun, Party Secretary and Chairman of the Xuchang Municipal Investment Group; Quan Feng, Chairman of Shenzhen Uniplasma; Chai Bohao, Deputy General Manager of Shenzhen Uniplasma; Du Ping, Deputy Director of the Henan Branch of the China Development Bank; Li Ge, Chairman of Huanghe Xuanfeng; Pang Wenlong, General Manager of Huanghe Xuanfeng, along with other leaders.

New Materials, New Future | Uniplasma showcases at the Carbontech 2025 Carbon Materials Exhibition

On December 11, the 9th International Carbon Materials Conference and Industry Exhibition, Carbontech 2025, concluded successfully at the Shanghai New International Expo Center. At the event, Uniplasma made a prominent appearance with its core technologies and products, bringing together industry peers to discuss new directions and a promising future for the diamond industry.

“Core” Future, “Core” Solutions | Uniplasma showcases at the 27th China Hi-Tech Fair and the Asia Semiconductor and Integrated Circuit Industry Exhibition

On November 16, the 27th China Hi-Tech Fair and the Asia Semiconductor and Integrated Circuit Industry Exhibition concluded successfully at the Shenzhen (Bao’an) International Convention and Exhibition Center. At the event, Uniplasma showcased its MPCVD equipment and diamond material products, offering a “core” solution to address the semiconductor industry’s “thermal management crisis” and injecting “core” momentum.