Connecting through chips, shaping the future together | Uniplasma showcases at the 2nd Fourth-Generation Semiconductor Technology Symposium

Strong Partnership | Uniplasma joins hands with Huanghe Xuanfeng, and China’s first 8-inch diamond heat sink production line has been officially completed.

On February 28, the unveiling ceremony of Henan Fengyouchuang Materials Technology Co., Ltd. (hereinafter referred to as Henan Fengyouchuang), a joint venture established by Shenzhen Uniplasma and Huanghe Xuanfeng, was solemnly held in Xuchang. Attending the ceremony were Yang Zengjun, Party Secretary and Chairman of the Xuchang Municipal Investment Group; Quan Feng, Chairman of Shenzhen Uniplasma; Chai Bohao, Deputy General Manager of Shenzhen Uniplasma; Du Ping, Deputy Director of the Henan Branch of the China Development Bank; Li Ge, Chairman of Huanghe Xuanfeng; Pang Wenlong, General Manager of Huanghe Xuanfeng, along with other leaders.

Jointly Exploring New Frontiers, Jointly Creating a New Future | Uniplasma Makes Its Debut at the 2026 (Second) Future Semiconductor Industry Innovation Conference

On April 16–17, the 2026 (Second) Future Semiconductor Industry Innovation Conference was grandly held at Yinsan Lake in Suzhou.

Connecting through chips, shaping the future together | Uniplasma showcases at the 2nd Fourth-Generation Semiconductor Technology Symposium

On March 18–19, the 2026 Second Symposium on Fourth-Generation Semiconductor Technology was grandly held in Hangzhou. As a leading enterprise in China’s MPCVD equipment and diamond materials sectors, Uniplasma showcased its core products and technical solutions at the conference, engaging in in-depth exchanges with industry peers and jointly discussing the future of the sector.

New Materials, New Future | Uniplasma showcases at the Carbontech 2025 Carbon Materials Exhibition

On December 11, the 9th International Carbon Materials Conference and Industry Exhibition, Carbontech 2025, concluded successfully at the Shanghai New International Expo Center. At the event, Uniplasma made a prominent appearance with its core technologies and products, bringing together industry peers to discuss new directions and a promising future for the diamond industry.

“Core” Future, “Core” Solutions | Uniplasma showcases at the 27th China Hi-Tech Fair and the Asia Semiconductor and Integrated Circuit Industry Exhibition

On November 16, the 27th China Hi-Tech Fair and the Asia Semiconductor and Integrated Circuit Industry Exhibition concluded successfully at the Shenzhen (Bao’an) International Convention and Exhibition Center. At the event, Uniplasma showcased its MPCVD equipment and diamond material products, offering a “core” solution to address the semiconductor industry’s “thermal management crisis” and injecting “core” momentum.

Breaking the Heatwave, Empowering with Core Technology | Uniplasma showcases diamond materials at the 2025 Bay Chip Exhibition

From October 15 to 17, the 2025 Bay Area Semiconductor Industry Ecosystem Expo was grandly held at the Shenzhen (Futian) Convention and Exhibition Center. Uniplasma showcased diamond films, thermal‑sink diamonds, optical diamonds, boron‑doped diamonds (BDD), and MPCVD equipment, comprehensively demonstrating the company’s semiconductor thermal‑management solutions based on diamond materials as well as its technological prowess in MPCVD equipment.

Strong Partnership | Uniplasma and Huanghe Xuanfeng Jointly Establish a Joint Venture—Henan Fengyouchuang

On September 17, Uniplasma and Huanghe Xuanfeng jointly established a joint venture—Henan Fengyouchuang Materials Technology Co., Ltd. (hereinafter referred to as Henan Fengyouchuang). This collaboration not only represents an efficient synergy between “cutting-edge technology” and an “industrial flagship,” but will also seamlessly close the entire industrial chain—from “equipment R&D” and “material growth” to “large-scale application”—marking a major leap from technological leadership to market leadership. Uniplasma Chairman Quan Feng, Huanghe Xuanfeng Chairman Li Ge, Vice Chairman and General Manager Pang Wenlong, and others attended the signing ceremony.

Adhesion Strength Testing of Diamond Films on Silicon Carbide Substrates

Diamond films, owing to their exceptional hardness, thermal conductivity, and chemical stability, are often bonded to silicon carbide substrates to form composite functional materials. The interfacial bonding strength between the two directly determines the service life of the composite under real‑world operating conditions, and the methods for its measurement as well as the interpretation of the results carry significant engineering implications.