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Innovation-Driven, Future-Focused: UPL showcased at FINE 2026 – The Future Industry New Materials Expo
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From June 10 to 12, the 2026 Future Industry New Materials Expo (FINE 2026) was held at the Shanghai New International Expo Centre. At the event, UPL made a prominent appearance, presenting its MPCVD (Microwave Plasma Chemical Vapor Deposition) systems alongside comprehensive diamond material solutions for diverse application scenarios. The company engaged with industry peers and downstream customers to explore the innovative uses and future trajectory of diamond in the semiconductor sector.
From June 10 to 12, the 2026 Future Industry New Materials Expo (FINE 2026) was held at the Shanghai New International Expo Centre. At the event, UPL made a prominent appearance, presenting its MPCVD (Microwave Plasma Chemical Vapor Deposition) systems alongside comprehensive diamond material solutions for diverse application scenarios. The company engaged with industry peers and downstream customers to explore the innovative uses and future trajectory of diamond in the semiconductor sector.
Notably, this year’s expo featured dedicated zones for AI chip and power device thermal management, as well as advanced semiconductor materials, where ultra-high thermal conductivity materials—including diamond and silicon carbide—drew unprecedented attention.
At its booth, UPL showcased its MPCVD reactors, large-area single-crystal diamond (30×30 mm), diamond heat-spreader substrates, optical-grade diamond, 6–8 inch diamond films, and boron-doped diamond (BDD), among other core products.
Leveraging diamond’s thermal conductivity exceeding 2,000 W/(m·K) and its superior electrical insulation properties, the material’s potential for heat dissipation in high-power chips, data-center liquid cooling, RF devices, and power modules was fully demonstrated. Throughout the show, the UPL booth attracted a steady stream of professional visitors seeking in-depth information on the company’s MPCVD equipment and multi-scenario diamond application solutions.
During the exhibition, UPL’s technical team held multiple face-to-face commercial and technical discussions with representatives from packaging and testing, power device manufacturing, and data-center thermal design fields. These conversations centered on engineering challenges such as MPCVD process stability, diamond growth uniformity, surface finishing precision, and interfacial thermal resistance control.
Through these exchanges, the team gained precise insights into the specific performance metrics and volume-production delivery requirements emerging from a range of new application areas. A number of visitors expressed immediate interest in sample testing and joint development, providing a clear pathway for future product qualification and integration.
Looking ahead, UPL remains committed to advancing MPCVD system optimization and expanding the commercial application of CVD diamond materials. By consistently delivering robust and reliable “material platforms” tailored to diverse customer needs, the company aims to collaborate with industry partners in driving broader industrial adoption of diamond across next-generation semiconductor technologies and cutting-edge scientific fields.
Image source: FINE 2026 Organizing Committee
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