From July 15 to 17, the 14th Western Global Semiconductor Expo (CWICE 2026) was held at the Chengdu Century City New International Convention and Exhibition Center. As a leading domestic player in MPCVD (Microwave Plasma Chemical Vapor Deposition) equipment and high-quality diamond materials, UPL (Youpulai) showcased its proprietary MPCVD systems and premium diamond substrates at the event.
From June 10 to 12, the 2026 Future Industry New Materials Expo (FINE 2026) was held at the Shanghai New International Expo Centre. At the event, UPL made a prominent appearance, presenting its MPCVD (Microwave Plasma Chemical Vapor Deposition) systems alongside comprehensive diamond material solutions for diverse application scenarios. The company engaged with industry peers and downstream customers to explore the innovative uses and future trajectory of diamond in the semiconductor sector.
On April 16–17, the 2026 (Second) Future Semiconductor Industry Innovation Conference was grandly held at Yinsan Lake in Suzhou.
On March 18–19, the 2026 Second Symposium on Fourth-Generation Semiconductor Technology was grandly held in Hangzhou. As a leading enterprise in China’s MPCVD equipment and diamond materials sectors, Uniplasma showcased its core products and technical solutions at the conference, engaging in in-depth exchanges with industry peers and jointly discussing the future of the sector.
On February 28, the unveiling ceremony of Henan Fengyouchuang Materials Technology Co., Ltd. (hereinafter referred to as Henan Fengyouchuang), a joint venture established by Shenzhen Uniplasma and Huanghe Xuanfeng, was solemnly held in Xuchang. Attending the ceremony were Yang Zengjun, Party Secretary and Chairman of the Xuchang Municipal Investment Group; Quan Feng, Chairman of Shenzhen Uniplasma; Chai Bohao, Deputy General Manager of Shenzhen Uniplasma; Du Ping, Deputy Director of the Henan Branch of the China Development Bank; Li Ge, Chairman of Huanghe Xuanfeng; Pang Wenlong, General Manager of Huanghe Xuanfeng, along with other leaders.
New Materials, New Future | Uniplasma showcases at the Carbontech 2025 Carbon Materials Exhibition
On December 11, the 9th International Carbon Materials Conference and Industry Exhibition, Carbontech 2025, concluded successfully at the Shanghai New International Expo Center. At the event, Uniplasma made a prominent appearance with its core technologies and products, bringing together industry peers to discuss new directions and a promising future for the diamond industry.
On November 16, the 27th China Hi-Tech Fair and the Asia Semiconductor and Integrated Circuit Industry Exhibition concluded successfully at the Shenzhen (Bao’an) International Convention and Exhibition Center. At the event, Uniplasma showcased its MPCVD equipment and diamond material products, offering a “core” solution to address the semiconductor industry’s “thermal management crisis” and injecting “core” momentum.
From October 15 to 17, the 2025 Bay Area Semiconductor Industry Ecosystem Expo was grandly held at the Shenzhen (Futian) Convention and Exhibition Center. Uniplasma showcased diamond films, thermal‑sink diamonds, optical diamonds, boron‑doped diamonds (BDD), and MPCVD equipment, comprehensively demonstrating the company’s semiconductor thermal‑management solutions based on diamond materials as well as its technological prowess in MPCVD equipment.
On September 17, Uniplasma and Huanghe Xuanfeng jointly established a joint venture—Henan Fengyouchuang Materials Technology Co., Ltd. (hereinafter referred to as Henan Fengyouchuang). This collaboration not only represents an efficient synergy between “cutting-edge technology” and an “industrial flagship,” but will also seamlessly close the entire industrial chain—from “equipment R&D” and “material growth” to “large-scale application”—marking a major leap from technological leadership to market leadership. Uniplasma Chairman Quan Feng, Huanghe Xuanfeng Chairman Li Ge, Vice Chairman and General Manager Pang Wenlong, and others attended the signing ceremony.
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