04

2023

-

04

Preparation Method of Diamond Coatings

Author:


Currently, the preparation of diamond coatings predominantly relies on microwave plasma chemical vapor deposition. The reactive gas sources used for growing MPCVD single-crystal diamond coatings mainly include hydrogen (H2), methane (CH4), nitrogen (N2), and oxygen (O2). Under the excitation of the microwave field, these gases dissociate into atomic species such as H, O, and N, or into active functional groups like CH2, CH3, C2H2, and OH.

Preparation methods for diamond coatings

 

Currently, the preparation of diamond coatings predominantly relies on microwave plasma chemical vapor deposition. The primary reactant gases used in growing MPCVD single-crystal diamond coatings include hydrogen (H₂), methane (CH₄), nitrogen (N₂), and oxygen (O₂). Under the excitation of the microwave field, these gases dissociate into atomic species such as H, O, and N, or into reactive functional groups like CH₂, CH₃, C₂H₂, and OH. Among these, carbon‑containing active species (CH₂, CH₃, C₂H₂) form a gas–solid interfacial layer on the diamond surface, enabling the growth of diamond (sp³ hybridization) alongside amorphous carbon or graphite (sp² hybridization) under either a dynamic equilibrium model or a non‑equilibrium thermodynamic framework. Since hydrogen plasma etches amorphous carbon or graphite (sp²) much more rapidly than it etches diamond (sp³), the non‑diamond phases at the MPCVD diamond surface are swiftly removed, thereby facilitating diamond growth.

 Diamond coating

Specifically, it is divided into the following processes:

A→B process: Under the action of microwave plasma, the C–H bonds on the diamond surface cleave; the detached hydrogen atoms combine with hydrogen atoms in the plasma to form H₂, while the diamond surface develops carbon dangling bonds and excess electrons.

Process B→C: A methyl group (CH3) in the plasma forms a covalent bond with excess electrons on the diamond surface.

C→D Process: A hydrogen atom is removed from the methyl group on the diamond surface, exposing an electron.

D→E process: The carbon rings on the diamond surface open, generating an extra electron and a C=C bond.

E→F Process: The C=C bonds on the diamond surface are converted into C–C bonds, releasing excess electrons that subsequently form new C–C bonds with the surplus electrons on the diamond surface, thereby incorporating the carbon source into the diamond surface.

F→G process: Hydrogen atoms in the plasma combine with excess electrons on the diamond surface.

Subsequently, repeated cycles from A to G enable the growth of single-crystal diamond.

 

Diamond coating

Related News

Empowering Sensing, Advancing Optics | Uniplasma Shines at the 27th China International Optoelectronic Exposition

From September 9 to 11, the 27th China International Optoelectronic Exposition (CIOE 2026) was grandly held.

Collaborative Innovation, Converging the Core | UPL Shines at the 14th Western Global Semiconductor Expo

From July 15 to 17, the 14th Western Global Semiconductor Expo (CWICE 2026) was held at the Chengdu Century City New International Convention and Exhibition Center. As a leading domestic player in MPCVD (Microwave Plasma Chemical Vapor Deposition) equipment and high-quality diamond materials, UPL (Youpulai) showcased its proprietary MPCVD systems and premium diamond substrates at the event.

Innovation-Driven, Future-Focused: UPL showcased at FINE 2026 – The Future Industry New Materials Expo

From June 10 to 12, the 2026 Future Industry New Materials Expo (FINE 2026) was held at the Shanghai New International Expo Centre. At the event, UPL made a prominent appearance, presenting its MPCVD (Microwave Plasma Chemical Vapor Deposition) systems alongside comprehensive diamond material solutions for diverse application scenarios. The company engaged with industry peers and downstream customers to explore the innovative uses and future trajectory of diamond in the semiconductor sector.

Jointly Exploring New Frontiers, Jointly Creating a New Future | Uniplasma Makes Its Debut at the 2026 (Second) Future Semiconductor Industry Innovation Conference

On April 16–17, the 2026 (Second) Future Semiconductor Industry Innovation Conference was grandly held at Yinsan Lake in Suzhou.

Connecting through chips, shaping the future together | Uniplasma showcases at the 2nd Fourth-Generation Semiconductor Technology Symposium

On March 18–19, the 2026 Second Symposium on Fourth-Generation Semiconductor Technology was grandly held in Hangzhou. As a leading enterprise in China’s MPCVD equipment and diamond materials sectors, Uniplasma showcased its core products and technical solutions at the conference, engaging in in-depth exchanges with industry peers and jointly discussing the future of the sector.

Strong Partnership | Uniplasma joins hands with Huanghe Xuanfeng, and China’s first 8-inch diamond heat sink production line has been officially completed.

On February 28, the unveiling ceremony of Henan Fengyouchuang Materials Technology Co., Ltd. (hereinafter referred to as Henan Fengyouchuang), a joint venture established by Shenzhen Uniplasma and Huanghe Xuanfeng, was solemnly held in Xuchang. Attending the ceremony were Yang Zengjun, Party Secretary and Chairman of the Xuchang Municipal Investment Group; Quan Feng, Chairman of Shenzhen Uniplasma; Chai Bohao, Deputy General Manager of Shenzhen Uniplasma; Du Ping, Deputy Director of the Henan Branch of the China Development Bank; Li Ge, Chairman of Huanghe Xuanfeng; Pang Wenlong, General Manager of Huanghe Xuanfeng, along with other leaders.

New Materials, New Future | Uniplasma showcases at the Carbontech 2025 Carbon Materials Exhibition

On December 11, the 9th International Carbon Materials Conference and Industry Exhibition, Carbontech 2025, concluded successfully at the Shanghai New International Expo Center. At the event, Uniplasma made a prominent appearance with its core technologies and products, bringing together industry peers to discuss new directions and a promising future for the diamond industry.

“Core” Future, “Core” Solutions | Uniplasma showcases at the 27th China Hi-Tech Fair and the Asia Semiconductor and Integrated Circuit Industry Exhibition

On November 16, the 27th China Hi-Tech Fair and the Asia Semiconductor and Integrated Circuit Industry Exhibition concluded successfully at the Shenzhen (Bao’an) International Convention and Exhibition Center. At the event, Uniplasma showcased its MPCVD equipment and diamond material products, offering a “core” solution to address the semiconductor industry’s “thermal management crisis” and injecting “core” momentum.