On November 16, the 27th China Hi-Tech Fair and Asia Semiconductor and IC Industry Exhibition successfully concluded at the Shenzhen (Bao’an) International Convention and Exhibition Center. At the event, Uniplasma showcased its MPCVD equipment and diamond material products to provide a "core" solution for the semiconductor industry's looming "thermal management crisis" and inject new "core" momentum.

With the continuous rise in 6G communications, artificial intelligence, and high-performance CPU/GPU computing power loads, traditional copper-based heat dissipation, heat pipes, and air cooling systems are gradually approaching their limits when facing hotspots of hundreds or even thousands of W/cm², making it difficult to meet the cooling needs of high-power chips.

Among many heat sink materials, diamond heat sink materials naturally have a thermal conductivity of up to 2000 W/(m·K), which is four times that of copper and more than eight times that of aluminum. Meanwhile, its coefficient of thermal expansion is only 1.0–1.5×10^-6/K, highly compatible with the core materials of semiconductor chips such as silicon and silicon carbide (2.7×10^-6/K). This high similarity in thermal properties ensures that diamond heat sinks can maintain interface stability even after tens of thousands of temperature cycles, effectively preventing delamination issues caused by thermal expansion mismatch.

These excellent physical and chemical properties make diamond not only capable of heat dissipation but also uniquely valuable in applications such as laser devices, optical windows, and specialized sensors, thereby providing more diversified material options for the semiconductor industry chain.

As a result, Uniplasma's diamond material products immediately became the focus of attention at the exhibition. Attendees actively exchanged insights on diamond heat sink performance, innovative achievements, case studies, market conditions, and other diversified application scenarios, collectively exploring how diamond materials can inject new momentum into the development of the semiconductor industry.

This debut not only served as an important opportunity for Uplai to showcase its technological capabilities and innovative results to the industry but also aims to work together with partners along the industry chain to promote innovative applications of diamond materials in more semiconductor scenarios, turning diamond—a material with the best natural thermal conductivity, outstanding hardness, and optical properties—into an advanced material solution that can be widely applied in the semiconductor industry as soon as possible.