>
>
>
Breaking the Heat Dissipation Bottleneck, Empowering Chip Dynamics | Uniplasma Showcases Diamond Materials at the 2025 Bay Chip Expo
[Recommend]

Breaking the Heat Dissipation Bottleneck, Empowering Chip Dynamics | Uniplasma Showcases Diamond Materials at the 2025 Bay Chip Expo

  • Author:
  • Origin:
  • Time of issue:2025-12-22 10:29
  • Views:

(Summary description)On October 15 to 17, 2025, the Bay Area Semiconductor Industry Ecosystem Expo was grandly held at the Shenzhen (Futian) Convention and Exhibition Center. Uniplasma showcased diamond thin films, heat sink diamonds, optical diamonds, boron-doped diamonds (BDD), and MPCVD equipment at the exhibition, comprehensively demonstrating the company's semiconductor heat dissipation solutions based on diamond materials and its technical capabilities in MPCVD equipment.

[Recommend]

Breaking the Heat Dissipation Bottleneck, Empowering Chip Dynamics | Uniplasma Showcases Diamond Materials at the 2025 Bay Chip Expo

(Summary description)On October 15 to 17, 2025, the Bay Area Semiconductor Industry Ecosystem Expo was grandly held at the Shenzhen (Futian) Convention and Exhibition Center. Uniplasma showcased diamond thin films, heat sink diamonds, optical diamonds, boron-doped diamonds (BDD), and MPCVD equipment at the exhibition, comprehensively demonstrating the company's semiconductor heat dissipation solutions based on diamond materials and its technical capabilities in MPCVD equipment.

  • Categories:Company News
  • Author:
  • Origin:
  • Time of issue:2025-12-22 10:29
  • Views:0
Information

On October 15 to 17, 2025, the Bay Area Semiconductor Industry Ecosystem Expo was grandly held at the Shenzhen (Futian) Convention and Exhibition Center. Uniplasma showcased diamond thin films, heat sink diamonds, optical diamonds, boron-doped diamonds (BDD), and MPCVD equipment at the exhibition, comprehensively demonstrating the company's semiconductor heat dissipation solutions based on diamond materials and its technical capabilities in MPCVD equipment.



 

As a leading enterprise in domestic MPCVD technology and diamond materials, Uniplasma's diamond material products, prepared using its independently developed MPCVD equipment, immediately became a focal point at the exhibition. Heat sink diamond substrates used in high-end chip thermal management boast ultra-high thermal conductivity, effectively addressing the 'heat dissipation bottleneck' of next-generation high-power chips. Optical diamonds, with their excellent light transmittance, are suitable for high-power lasers and other high-end infrared optical equipment. Boron-doped diamond (BDD) electrode materials, with their wide potential window and excellent electrochemical stability, highlight their immense potential in semiconductor devices and electrochemical sensing applications.

These innovative products, moving from the laboratory to industrialization, attracted numerous visitors who stopped to learn more, engaging in discussions with onsite staff about equipment performance, material processes, and collaboration models. Friends from all over the world showed great interest not only in Uniplasma's diamond material products but also highly recognized the core domestically produced 915MHz high-power MPCVD equipment behind them, with many visitors expressing cooperation intentions on-site.



 

Looking ahead, UPL will continue to uphold its corporate mission as a 'Microwave Plasma Pioneer,' deeply explore MPCVD technology applications, and continuously promote breakthroughs and innovative developments of diamond materials in broader fields such as semiconductors, optics, and quantum technology, injecting strong Chinese 'core' power into the global semiconductor industry ecosystem.

Image source: Marketing Department, 2025 Bay Area Semiconductor Expo

Scan the QR code to read on your phone

Related News