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Heat Sink Application

Heat Sink Application

  • 分类:Applications
  • 发布时间:2021-07-20 16:11:12
  • 访问量:0
概要:Diamond has a higher thermal conductivity at room temperature, 4 times that of silicon carbide and 5 times that of copper. In addition, it also has excellent properties such as low thermal expansion coefficient, high elastic modulus, and electrical insulation. It is the preferred heat sink for high power density equipment. . It has broad application prospects in military computers, high-performance servers, aerospace electronic equipment and other fields.
概要:Diamond has a higher thermal conductivity at room temperature, 4 times that of silicon carbide and 5 times that of copper. In addition, it also has excellent properties such as low thermal expansion coefficient, high elastic modulus, and electrical insulation. It is the preferred heat sink for high power density equipment. . It has broad application prospects in military computers, high-performance servers, aerospace electronic equipment and other fields.
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Thermal application of diamond

Diamond has a higher thermal conductivity at room temperature, 4 times that of silicon carbide and 5 times that of copper. In addition, it also has excellent properties such as low thermal expansion coefficient, high elastic modulus, and electrical insulation. It is the preferred heat sink for high power density equipment. . It has broad application prospects in military computers, high-performance servers, aerospace electronic equipment and other fields.